Business
TECNO SPARK 9 Pro Stands Out as Selfie Phone Compared with Samsung A13 4G and Redmi Note 11
Published
4 years agoon
It is today’s new generation of smart phone brand with elegant artistic design and contemporary cutting-edge camera technology
HONG KONG, Hong Kong, June 7, 2022/APO Group/ — The competition in the mobile phone industry has been increasingly intense in recent years and many brands launched their new mobile phone products with better features and design, such as OPPO, TECNO (www.TECNO-Mobile.com), Samsung, Huawei, Vivo, Realme, Xiaomi and others, giving the youth of today more and more choices. This time three latest Android phones are selected to make a comparison and find out which stands out more. They are TECNO SPARK 9 Pro, Samsung Galaxy A13 4G and Redmi Note 11.
The three brands differ in design and functions. TECNO is an increasingly popular brand in the world. It is today’s new generation of smart phone brand with elegant artistic design and contemporary cutting-edge camera technology. Samsung and Redmi have long been fan favorites, and their smartphones are often popular with the most price-conscious consumers.

To understand where the similarities and highlights are, let’s firstly check out the key features of the three devices:
Display & Design
Talking about the display, all three phones allow the young generation to enjoy better mobile entertainment such as gaming and watching movies or short videos. TECNO SPARK 9 Pro comes with the 1080P FHD+ 6.6” dot-notch screen with 90.2% screen-to-body. and Samsung A13 4G has the same size of 6.6 inches 1080P FHD+ display, but screen-to-body is a little weaker with the figure 83.2%, while Redmi Note 11 highlights its 6.43 FHD+ Notch AMOLED display with 90Hz high refresh rate and 84.5% screen-to-body. Among the three, TECNO SPARK 9 Pro’s dot drop display obviously guarantees a larger screen for their users.
In terms of design, each of the three brands utilizes their brand’s iconic design language to target the younger generation. For Redmi Note 11, it has a trendy flat-edge body design with dual super linear speakers located at the top and bottom of the phone. TECNO SPARK 9 Pro applies trendy right-angled edge and 8.42mm lightweight slim body and the bright and matte stitching design at the back just like glittering sand, attract the users’ eyes as well, bringing a silky touch in hands. While Samsung Galaxy A13 4G continues its minimalist design with soft colors and a comfortable hold and touch.
TECNO SPARK 9 Pro stands out in front camera for selfie among the younger generation
Camera & Photography Experience
Speaking of the rear camera setup, all three phones have a 50MP main camera. Both Samsung Galaxy A13 4G and Redmi Note 11 highlight their quad-camera setup with a 50MP main camera (F1.8), a 2MP macro camera and a 2MP depth sensor. What’s different here is that Samsung Galaxy A13 sports a 5MP ultra-wide camera with a 123-degree viewing angle; while Redmi Note 11 is equipped with an 8MP camera with a 118-degree angle. TECNO SPARK 9 Pro, however, has the triple rear camera layout with a 50 MP main camera, 2 MP in-depth sensor and an 8W AI Lens.
TECNO SPARK 9 Pro stand out by its breakthrough of the 32MP super clear selfie camera to boost young people’s confidence in self-expression by enabling them to take clearer and brighter selfies. Higher pixels and better photosensitive performance are thanks to the updated features like Super Night Mode 3.0 and AI Portrait Restoration. While Samsung Galaxy A13 has an 8MP front camera with the featured bokeh effect, Redmi Note 11 is equipped with a 13MP front camera for stunning and natural selfies.
User experience: OS & Battery
The three phones have made amazing upgrades in software to further improve the user experience. TECNO SPARK 9 Pro is equipped with Android 12 HiOS 8.6, the New UI with customized SPARK theme conveying technical style of fashion by designed icons. It also upgraded in apps like the Super Boost 2.0, App Twin and the Language Master. The Android 12 One UI 4.1 adds vibes to Samsung Galaxy 13 4G, and its Samsung Knox offers multiple protections for your phone. Redmi Note 11 highlights in its latest Android skin MIUI 13, upgrading in privacy and system fonts. TECNO SPARK 9 Pro and Sumsang A13 4G wins this round.

As for the processor, the new TECNO SPARK 9 Pro is powered by MediaTek Helio G85 Chip Engine, a gaming-grade processor (an Arm Mali-G52 GPU, and the octa-core CPU with two Arm Cortex-A75 CPUs). Redmi Note 11 comes with a Snapdragon® 680 processor, a flagship-level 6nm process to deliver superior performance and conserve power. Samsung Galaxy A13 features its Samsung Exynos 8 Octa 850, a processor with 8 small ARM Cortex-A55 cores that clock with up to 2 GHz (octa core), offering stable and visually compelling gaming experience with reduced lag.
For battery, all three phones have a large-capacity 5,000 mAh battery life with slight difference in in-box chargers. TECNO SPARK 9 Pro comes with 128GB ROM (internal storage) + 4GB RAM memory, while both Samsung Galaxy 13 4G (32GB/64GB/128GB ROM+ 3GB/4GB/6GB RAM) and Redmi Note 11 (64GB/128GB ROM+ 4GB/6GB RAM) have different versions.
So which phone would you pick after browsing the comparison? TECNO SPARK 9 Pro stands out in front camera for selfie among the younger generation. This top-level configuration with 128+4G costs several dollars less than the other two, but has better features in front camera and the latest Android 12 system. The Redmi Note 11 performs well in the fast charger and its 8MP ultrawide camera experience, which could be a choice for those who don’t mind the price, while the Samsung A13 4G stands out with its brand power and no other obvious advantages.
Distributed by APO Group on behalf of TECNO Mobile.
You may like
-
Afreximbank and Development Bank of Southern Africa establish a Joint Project Preparation Facility to advance bankable projects in Southern Africa
-
Hong Kong sets out strategic vision for developing the Northern Metropolis and creating a global talent hub
-
Created to explore: Canon EOS R8 Mark II inspires full-frame confidence and stability in a travel-ready size
-
Load shedding has eased: South Africa now faces its next industrial energy test
-
Afreximbank extends US$10-million facility to Azania Bank to support Small and Medium-sized Enterprises (SMEs) in Tanzania
-
Hong Kong’s 2026 Policy Address: A Strategic Vision for a Bright New Era
Business
Afreximbank and Development Bank of Southern Africa establish a Joint Project Preparation Facility to advance bankable projects in Southern Africa
Published
2 hours agoon
September 18, 2026
Through the JPPF, the institutions will jointly originate, screen and prioritise projects and support the technical, financial and legal work required to address bankability constraints
The agreement is one of the first operational instruments to follow South Africa’s accession to the Afreximbank Establishment Agreement in February 2026. South Africa became Afreximbank’s 54th member state in February 2026, when the Bank also announced a US$ 8 billion Country Programme for the country. The agreement complements the Master Risk Participation Agreement signed by Afreximbank and DBSA in February 2026, extending the partnership upstream into project preparation. It also supports the objectives of South Africa’s National Development Plan 2030, SADC integration and implementation of the African Continental Free Trade Area (AfCFTA).
Mrs Kanayo Awani, Executive Vice President, Intra-African Trade and Export Development, signed on behalf of Afreximbank, while Mr. Greg Fyfe, Chief Investment Officer, DBSA, signed on behalf of his institution.
Through the JPPF, the institutions will jointly originate, screen and prioritise projects and support the technical, financial and legal work required to address bankability constraints. Priority sectors include power and energy, with particular attention to energy transition; transport and logistics; information and communication technology; strategic minerals beneficiation; and other mutually agreed sectors aligned with national, regional and continental development priorities. The framework will focus initially on South Africa and the wider Southern African region, with scope to consider other African jurisdictions of mutual interest.
Through this partnership with Afreximbank, we are leveraging our complementary strengths to improve project preparation
Through the JPPF, Afreximbank and DBSA will collaborate to advance high-impact projects from concept stage to bankability. The focus will be on trade-enabling infrastructure, industrial development, and export-oriented initiatives across South Africa and the Southern African region, with potential extension to other African jurisdictions of mutual strategic interest.
Commenting on the agreement, Mrs. Kanayo Awani, Executive Vice President, Intra-African Trade and Export Development at Afreximbank said:
“Africa’s infrastructure challenge is not only about shortage of capital; it is also about shortage of projects prepared to the standard required by investors and lenders. This JPPF addresses this critical constraint. By combining Afreximbank’s trade and industrialisation mandate with DBSA’s infrastructure-development expertise, we will help move priority projects from concept to investment readiness and mobilise the larger pools of public, private and blended finance required for implementation. For South Africa and the wider Southern Africa region, this is how project preparation becomes a practical instrument for industrialisation, export growth and regional integration under the AfCFTA.”
Gregory Fyfe, Chief Investment Officer at DBSA, said:
“The Joint Project Preparation Facility represents a significant step towards strengthening the pipeline of bankable infrastructure and industrial projects across South Africa and the Southern African region. Through this partnership with Afreximbank, we are leveraging our complementary strengths to improve project preparation. This will unlock investment opportunities and accelerate the delivery of infrastructure that supports economic growth, industrialisation and regional integration. This initiative reflects DBSA’s commitment to infrastructure-led development and to enabling sustainable, long-term impact through well-prepared projects that attract both public and private sector investment.”
Projects developed through the JPPF may seek downstream funding from Afreximbank, DBSA. They may also be presented to private investors, development finance institutions and commercial lenders, subject in every case to separate appraisal and approval. Both institutions will actively collaborate on origination, preparation, knowledge-sharing, and portfolio monitoring to accelerate project bankability and execution.
Distributed by APO Group on behalf of Afreximbank.
Events
Advancing the Agentic World, Building a Solid Silicon Foundation
Published
6 hours agoon
September 18, 2026
Key takeaways:
- Strategic focus: The rapid approach of an intelligent world is driving up demand for computing power. Huawei is focused on developing AI infrastructure, and is actively driving innovation in systems and architecture centered around SuperPoDs and SuperClusters. These efforts are aimed at building a solid silicon foundation for the intelligent world.
- Technological breakthroughs: Huawei unveiled the Atlas 960E SuperPoD, the first in the industry to use NPO. The company also launched an upgraded TaiShan 950 SuperPoD, as well as the OceanStor M900 (a memory context storage system). Interconnected with UnifiedBus, Huawei’s agentic SuperCluster can scale up to one million NPUs.
- Open ecosystems: Huawei is actively building out open computing ecosystems. To date, the Kunpeng ecosystem has attracted 4.16 million developers from around the world. CANN has moved to sustained, community-driven open-source development. Ascend now spans over 90 leading third-party open-source projects and is officially supported as a PyTorch accelerator backend.
SHANGHAI, CHINA – Media OutReach Newswire – 17 September 2026 – HUAWEI CONNECT 2026 kicked off today in Shanghai. The first keynote of the date was by David Wang, the Deputy Chairman of the Board and Rotating Chairman at Huawei. In his speech (Advancing the Agentic World, Building a Solid Silicon Foundation), Wang highlighted the work the company is doing alongside industry stakeholders to build powerful AI infrastructure, lay a solid computing foundation, and address the challenges and opportunities in the intelligent world to come.
AI is sweeping the world faster than any previous technological revolution. Today, foundation model parameters are rapidly approaching 10 trillion, and are projected to exceed 100 trillion by 2030. AI agents can now work on the same task continuously, for hours on end. By 2030, they will be able to handle tasks that span months.
In China alone, the average number of inference tokens consumed every day has surged to around 500 trillion, and is expected to reach quintillions (1018) by 2030.
On-device AI is also advancing rapidly. On-device models for smartphones have expanded from three billion parameters in 2024 to 30 billion today, and will push toward hundreds of billions in the near future.
These trends will set a much higher bar for the scale, performance, and reliability of underlying technical systems. Only by building powerful AI infrastructure can the industry lay a solid foundation for the future intelligent world.
An intelligent world is approaching – and faster than ever. To lead the charge into this new world, Huawei is laser-focused on building out AI infrastructure – the silicon foundation for the future to come.
In particular, Huawei’s AI strategy is centered on computing power, with a focus on monetizing hardware. The company is also sharpening its competitive edge through systems and architectural innovation. Centering these efforts on SuperPoDs and SuperClusters, the company aims to build a solid computing foundation and offer a new option for the world.
Huawei is a major contributor to open computing ecosystems, and will continue to support native training for mainstream foundation models on its systems, as well as supporting a vast range of models and applications.
For customers, Huawei provides flexible on-premises and cloud compute solutions for its customers to accelerate intelligent transformation across industries.
With diverse forms of compute, including solutions for micro-, low-tier, mid-range, and massive computing power – Huawei is driving the expansion of on-device and in-vehicle AI, making intelligence truly ubiquitous.
Additionally, Huawei is dedicated to building next-generation communications networks to bring readily available compute and intelligence to every person, home, and organization.
SuperPoDs gain broad consensus, with adoption growing in industries, academia, and research institutes
To date, over 1,000 Atlas 900 A3 SuperPoDs have been deployed, and Atlas 950 SuperPoD is seeing large-scale commercial use. While adoption continues to grow, SuperPoDs have gained broad acceptance across industry, academia, and research institutions as a key direction for AI infrastructure. Currently, a SuperPoD is explicitly defined as a computing system in which multiple computing nodes are tightly coupled through high-speed interconnect protocols, featuring unified memory addressing across physical nodes — functioning like a single logical computer.
SuperPoDs are the go-to choice for AI infrastructure buildout. Right now, 100k-NPU computing clusters have become the baseline for training SOTA models. However, traditional server architectures result in intra-cluster communications that account for over 40% of total training time, severely constraining Model FLOPs Utilization (MFU). Simulation results from Huawei’s Markov Lab show that a 100k-NPU cluster built with 4k-NPU SuperPoDs can deliver a 2.75x increase in MFU compared to a 100k-NPU cluster composed of 8-NPU servers.
11-chip UnifiedBus-powered portfolio for SuperPoDs and SuperClusters; the Atlas 960E SuperPoD –the industry’s first to use NPO
The Ascend series of chips is the most critical component in Huawei’s 11-chip UnifiedBus-powered portfolio for SuperPoDs and SuperClusters. Development on Ascend 960 has exceeded the company’s expectations, with performance doubling as planned. Ascend 960DT will be available in Q1 2027, three quarters ahead of the company’s original roadmap. And the Ascend 960PR will be ready in Q3 2027, one quarter ahead of schedule.
“We’re evolving our Ascend chip series on a one-generation-a-year cycle,” said Wang in his keynote. “In 2028 and 2029, we will roll out the Ascend 970 and 980 chips, respectively. Thanks to the Tau (τ) Scaling Law, not only will their compute specifications continue to double, but you can also expect to see huge improvements across the board in terms of memory bandwidth, memory capacity, interconnect bandwidth, and more.”
In addition to Ascend chips, Huawei has also developed a complete portfolio of chips for AI infrastructure, based on UnifiedBus, delivering key capabilities that cover computing, interconnect, storage, and management.
“SuperPoDs are designed to coordinate multiple NPUs through interconnect,” continued Wang. “We have developed a next-generation optical interconnect product based on near-packaged optics (NPO): the High-density Optical-interconnect-Node Engine (Hi-ONE).” Built on Huawei’s proprietary technologies, Hi-ONE has a multi-physics design for balancing optical, mechanical, electrical, electromagnetic, and thermal performance, realizing a transmission capacity of 7.2 Tbit/s per single engine.
“This is the industry’s first NPO product ready for mass production, delivering the largest transmission capacity. It is also the industry’s first NPO product with a built-in light source.”
This product combines high bandwidth and high reliability with low latency and low power consumption. This, coupled with UnifiedBus, will make it far easier to scale up SuperPoD interconnect systems.
Recently, Huawei submitted an implementation agreement (IA) on NPO to the Optical Internetworking Forum (OIF), a standards organization. The response from numerous industry partners has been widely positive. Huawei will continue its efforts to further refine the NPO industry ecosystem.
Using Ascend 960 chips and Hi-ONE, Huawei has developed the industry’s first NPO-based SuperPoDs: the Atlas 960E SuperPoDs. A single Atlas 960E SuperPoD can scale up to 4,096 NPUs, delivering 8 EFLOPS of FP8 compute performance, with up to 1 petabyte of HBM capacity. With 5,500 Hi-ONE units, this SuperPoD doesn’t need the 48,000 800G optical modules that would traditionally be required to connect all the NPUs. This cuts power consumption by over 550 kilowatts, while doubling the system’s fault-free operating time, achieving 99.8% system availability.
Combining the upgraded TaiShan 950 SuperPoD and context memory storage to power an ultrascale cluster with 1 million NPUs
As SOTA models scale to 10 trillion parameters, training and inference can no longer rely on a single AI server or AI SuperPoD – they require a more complex computing system. This system includes AI SuperPoDs, general-purpose SuperPoDs, and an interconnect system that features peer-to-peer interconnect and zero protocol conversion. For inference, including a petabyte-scale KV cache cluster is also a must.
To meet these demands, Huawei has fully upgraded its TaiShan 950 SuperPoD. Powered by UnifiedBus all-optical networking, this new SuperPoD supports up to 4,096 nodes with a unified memory pool of up to 256 TB. This setup significantly improves agent performance. For sandbox-intensive workloads, startup speeds for 100,000 sandboxes are 30 times faster than traditional servers, and sandbox density can be improved by an additional 25%. For vector search across 10 billion x 1,000-dimensional vectors, this SuperPoD delivers twice the search efficiency of traditional servers.
Huawei has also launched OceanStor M900 – a UnifiedBus-powered context memory storage cluster that delivers multi-tier KV caching for agent-heavy and longer-context workloads. Designed for agentic inference, this cluster supports one-hop direct access and provides a petabyte-scale KV cache for the L3.5 layer. OceanStor M900 also uses hybrid media and an optimized retention algorithm, extending SSD read/write lifespan by 16-fold. This ensures a higher KV cache hit rate alongside long-term stability and reliability from the ground up.
Combining its strengths in computing and communications, Huawei has built a brand-new agentic SuperCluster to accelerate training and inference for 10-trillion-parameter models. This SuperCluster uses UnifiedBus to consolidate multiple interconnect protocols into a single unified protocol, significantly reducing protocol conversion overhead. This delivers peer-to-peer interconnect between subsystems like Ascend SuperPoDs, Kunpeng SuperPoDs, and KV cache clusters. The SuperCluster also comes with a multi-tier, high-bandwidth, and large-capacity storage system that enables direct single-hop access for all KV cache tiers.
With a two-tier, four-plane Clos architecture, the SuperCluster can interconnect up to 512,000 NPUs. When combined with a multi-rail topology, this cluster can support up to one million NPUs.
One of Huawei’s core strategies: Going open source and open system to build out computing ecosystems
The Kunpeng ecosystem is driving digital and intelligent innovation across a wide range of industries. To date, the Kunpeng ecosystem has attracted over 4.16 million developers and more than 7,200 ecosystem partners from around the globe. The community currently supports over 560 open-source projects worldwide. openEuler has seen more than 20 million installations, securing the largest share in China’s server OS market.
The Ascend ecosystem has reached a new inflection point. The Compute Architecture for Neural Networks (CANN) is the foundation of the Ascend ecosystem. Today, CANN has moved to sustained, community-driven open-source development, which has brought the platform from usable to user-friendly.
External CANN developers now comprise 61% of all CANN developers, outnumbering internal developers for the first time. With over 5,200 monthly active developers, the CANN community has become the most vibrant open-source community in China. What’s more, over 40 models have been natively pre-trained on Ascend and CANN, making it the only proven domestic stack capable of model pre-training.
Ascend now supports over 90 leading third-party open-source projects, including PyTorch, Triton, vLLM, and veRL. With strong support from the Linux Foundation, Ascend is the first official Chinese compute platform on PyTorch’s website. This gives developers around the world ready access to new innovations in the Ascend ecosystem.
Diverse forms of compute for ubiquitous on-device and in-vehicle AI
AI is expanding faster into all kinds of devices. To deliver an unparalleled AI experience across all scenarios, Huawei will continue to strengthen capabilities in four key areas:
First, Huawei will combine Kirin and Ascend chips to drive self-reliance and autonomy in on-device compute.
Second, Huawei will bring together Pangu models and third-party models to make on-device intelligence better and easier to use.
Third, HarmonyOS, as an Agent OS for ubiquitous intelligence, will be completely redefined from the ground up – spanning system architecture, how it operates, and interaction logic – to enable human-agent collaboration.
Fourth, Huawei will keep cultivating a diverse AI ecosystem, which is the foundation for its system agent Celia to thrive.
Huawei plans to build four on-device computing platforms: for AI phones, AI PCs, vehicles, and homes. Through cross-device and device-cloud compute synergy, Huawei will be able to provide distributed swarm intelligence, delivering integrated and continuous intelligent services across personal mobile, office, vehicle, and home spaces, ultimately bringing intelligence to every person and every space.
Building next-generation communications that prioritize readily available compute, because without networks, all compute is siloed
Next-generation communications networks are crucial for fully unleashing the value of AI compute. We are driving the upgrade to networks that, in addition to connecting people, will prioritize delivering readily available compute. These networks will be underpinned by 5G-A/6G, 10-gigabit optical networks, and multi-tier, low-latency bearer networks, delivering intelligent connectivity across data centers, the edge, and devices.
Concluding his keynote, Wang expressed that AI “may well be the final technological revolution in human history,” noting that its impact is deeper and broader, and coming faster than anyone could have ever imagined. “No single company,” he said, “can build an intelligent world alone.”
He stressed Huawei’s ongoing commitments moving forward:
Huawei will remain committed to building a solid silicon foundation to make computing power readily accessible to all.
The company will continue to open source its software, helping developers unleash their full potential.
It will continue to embrace a wide range of models and applications, unlocking value in every form.
“And we will continue to work together to drive shared success, growing together with our customers and partners around the world,” Wang concluded. “Let’s work together to build a fully connected, intelligent world.”
Themed Advancing the Agentic World, HUAWEI CONNECT 2026 will delve into AI across three dimensions: strategy, technology, and ecosystems. You can expect an in-depth look at our latest strategic initiatives, and we’ll also be unveiling our all-new digital and intelligent infrastructure products, scenario-specific solutions for industries, and development tools. The event will run from September 17 to 19 at the Shanghai World Expo Exhibition & Convention Center and Shanghai Expo Center. For more information, please visit HUAWEI CONNECT 2026 online at www.huawei.com/en/events/huaweiconnect
FAQs:
Q1: What is a SuperPoD, and why is it becoming increasingly important?
A SuperPoD is a computing system in which multiple computing nodes are tightly coupled through high-speed interconnect, enabling them to share unified memory and function like a single computer. As foundation model training and inference continue to scale up, SuperPoDs can reduce communications overhead in large-scale clusters and improve Model FLOPs Utilization (MFU). They have gained broad consensus across industry, academia, and research institutes in AI infrastructure, and are the go-to choice for AI infrastructure buildout.
Q2: What makes the Atlas 960E SuperPoDs special?
The Atlas 960E SuperPoD is the industry’s first NPO-based SuperPoD. A single Atlas 960E SuperPoD can scale up to 4,096 NPUs, delivering 8 EFLOPS of FP8 compute performance, with up to 1 petabyte of HBM capacity. With 5,500 Hi-ONE units, this SuperPoD doesn’t need the 48,000 800G optical modules that would traditionally be required to connect all the NPUs. This cuts power consumption by over 550 kilowatts, while doubling the system’s fault-free operating time, achieving 99.8% system availability. Atlas 960E SuperPoDs can provide efficient and reliable computing power for large-scale AI training and inference.
Q3: What is NPO, and what role does Hi-ONE play in a SuperPoD?
NPO stands for Near-Packaged Optics, an optical interconnect technology designed for high-speed connectivity. Hi-ONE, developed by Huawei, is the industry’s first NPO product ready for mass production. It delivers the largest transmission capacity at 7.2 Tbit/s and is currently the industry’s only NPO product with a built-in light source. Hi-ONE, coupled with UnifiedBus, will make it far easier to scale up SuperPoD interconnect systems.
Events
Huawei Unveils the Industry’s First NPO Optical Engine with Built-in Light Source, Hi-ONE, Leading the Way in High-Speed Optical Interconnect Technology Innovation
Published
6 hours agoon
September 18, 2026
Summary:
- At HUAWEI CONNECT 2026, Huawei unveiled the industry’s first NPO optical engine with Built-in Light Source, Hi-ONE, offering a total capacity of 7.2 TB/s and enabling Huawei to be the first to mass produce such an optical engine.
- Hi-ONE has been applied to the Ascend 960 SuperPoD, built on the “UnifiedBus plus Hi-ONE” architecture. This has reduced the number of 800G optical modules within the SuperPoD by 48,000, significantly lowered system power consumption, and enhanced reliability.
- In May 2026, the standard proposal for “12.8 TB/s NPO Module”, jointly submitted by the China Academy of Information and Communications Technology (CAICT), Huawei, and other companies, was officially initiated by the OIF, receiving support from more than 40 global industry chain vendors.
SHANGHAI, CHINA – Media OutReach Newswire – 17 September 2026 – At HUAWEI CONNECT 2026, Huawei unveiled the industry’s first NPO optical engine with Built-in Light Source, Hi-ONE, offering a total capacity of 7.2 TB/s and enabling Huawei to be the first to mass produce such an optical engine. The Ascend 960 SuperPoD, built on the “UnifiedBus plus Hi-ONE” architecture, has already adopted the Hi-ONE optical engine powered by NPO. Hi-ONE is the industry’s first-ever optical engine to adopt a built-in light source architecture, achieving high-density, high-speed optical interconnect while significantly reducing power consumption and latency for signal transmission. The launch of Hi-ONE marks the beginning of NPO technology’s transition from industry consensus to large-scale commercial use, injecting new momentum into the AI computing industry.
NPO technology path: Balancing innovation and ecosystem continuity
NPO technology realizes close interaction between optical and electrical signals but maintains the independence of the optical engine, thus maximizing the continuity of customer usage habits and industry ecosystems. By following this technology path, Huawei has developed the innovative Hi-ONE optical engine, which currently stands as the NPO product with the highest transmission capacity in the industry and the first NPO product to adopt a built-in light source architecture. Rooted in self-developed technologies, Huawei has achieved breakthroughs in key areas such as bandwidth, reliability, power consumption, and latency.
High bandwidth and high reliability: Hi-ONE is the first optical engine to integrate 36 channels of optical transceivers, significantly reducing the number of discrete components and lowering failure rates at the very source. Hi-ONE integrates key technologies, including compound optical chips, silicon photonic chips, and optoelectronic RF chips. Through a balanced design of optical, mechanical, electrical, magnetic, and thermal elements, Hi-ONE supports a transmission capacity of 7.2 TB/s on a single optical engine, and makes built-in light sources a reality in the NPO engine. As a result, overall reliability is improved by 10 times, ensuring the stable operation of long-duration training tasks.
Low power consumption and low latency: With the adoption of a linear direct-drive architecture, Hi-ONE eliminates the need for high-power oDSP chips, cutting power consumption by approximately 66% and latency by about 90%. This both lowers energy costs and boosts communications efficiency.
Standards and ecosystems drive industry consensus
Alongside product innovation, Huawei has also made progress in NPO standards and industry ecosystem development. In May 2026, the standard proposal for “12.8 TB/s NPO Module”, jointly submitted by the China Academy of Information and Communications Technology (CAICT), Huawei, and other companies, was officially initiated by the OIF, with support from more than 40 industry chain vendors worldwide.
From technological breakthroughs to product application, and from international standards to industry ecosystem development, Huawei is driving NPO from industry consensus to large-scale commercial use. It is achieving this through a combination of strong technological innovation and open collaboration with global industry partners, with the ultimate goal of shaping a new AI computing industry landscape.
FAQs:
Q1: What is NPO?
A: NPO, short for Near-Packaged Optics, is an optical interconnect technology that keeps optical engines close to switching chips, shortening the transmission distance between optical and electrical signals while maintaining the independence of optical engines.
Q2: What is the OIF?
A: The OIF, or Optical Internetworking Forum, plays a key role as a core standards developer and interoperability promoter in the optical communications industry. It has huge influence, particularly in the fields of high-speed optical modules and data center interconnect.
The issuer is solely responsible for the content of this announcement.
Trending
-
Energy4 days agoAfrican Energy Week Remains a Forum for Investment, Dialogue and Continental Growth
-
Energy4 days agoNaledi Mining Services Chief Executive Officer (CEO) Joins African Mining Week (AMW) 2026 Amid Technical, Operational Expansion
-
Business4 days agoMiners Association of Nigeria (MAN) and Nigerian Association of Chambers of Commerce, Industry, Mines and Agriculture (NACCIMA) Sign Strategic Partnership
-
Business3 days agoAPO Group Launches New Brand as Africa’s Only Strategic Communications Consultancy with Owned Distribution
-
Business4 days agoAngola’s Angolan National Agency for Petroleum, Gas and Biofuels (ANPG) Signs New Deepwater Deals at Angola Oil & Gas (AOG) 2026
-
Tech3 days agoTrusted voices, peer validation, and relatable customer situations drive commercial and brand success in B2B campaigns
-
Events3 days agoHyperscalers Convergence Africa 2026 sets action agenda for Africa’s Digital Infrastructure Buildout
-
Energy3 days agoOne Month to Go: African Energy Week (AEW) 2026 Gears Up for Five Days of Deals, Dialogue and Energy Leadership

