Business
Inaugural Smart Lighting Expo ignites future of lighting innovation
Published
3 years agoon
Over 1,300 exhibitors embrace rising opportunities in twin lighting fairs
Buyer registration Link
HONG KONG SAR – Media OutReach Newswire – 15 March 2024 -Lighting today has transcended its traditional role of mere illumination, emerging as a catalyst for enhancing well-being and creating a better environment for quality living. To embrace this exciting evolution and capitalise on the rising opportunities, the Hong Kong Trade Development Council (HKTDC) will organise the first-ever Smart Lighting Expo, one of the partner events of the Business of Innovation & Technology Week (BITWeek), which will take place alongside the 15th HKTDC Hong Kong International Lighting Fair (Spring Edition) (Spring Lighting Fair) under the theme of “Bright Lighting * Smart Living” at the Hong Kong Convention and Exhibition Centre (HKCEC) from 6-9 April 2024. Featuring more than 1,300 exhibitors from seven countries and regions, the twin lighting fairs will serve as ideal platforms for buyers to explore the latest technologies and discover a wide range of innovative lighting products for meeting the ever-changing needs in the market.
Inaugural Smart Lighting Expo ignites future of lighting innovation
According to Statista, the global smart lighting market is projected to surge to US$25.3 billion this year, a significant increase from US$8.1 billion in 2020. In line with this growth trajectory, an HKTDC survey of exhibitors and buyers at Hong Kong International Lighting Fair (Autumn Edition) and Hong Kong International Outdoor and Tech Light Expo 2023, found that 41% of respondents expect sales to increase in the lighting market this year, with 30% identifying smart lighting and solutions as the greatest driver for growth.
To empower businesses in fully capitalising on the growing opportunities across the entire smart lighting supply chain, the Smart Lighting Expo showcases a comprehensive array of products and solutions, ranging from connected lighting technologies such as chips, sensors, LED drivers, and IoT lighting platform, to smart lighting products and solutions like smart control systems and dimmers, smart luminaires, lighting applications and systems.
Industry players unveil cutting-edge smart lighting solutions
In collaboration with Shanghai Pudong Intelligent Lighting Association, the Smart Ecosystem and IoT Supply Chain Area will feature various key players in the smart lighting industry, including Midea, Sunricher, Merrytek, and many more. Other featured brands include Helvar, Valta, SkyLighting and Up-Shine Lighting, etc. The Smart Lighting Expo welcomes the group pavilions from important lighting industry base in the Greater Bay Area, including Zhongshan, Foshan and Jiangmen. Highlighted products include:
Hong Kong exhibitor Mindstec Asia Limited (Booth no.: 1A-E02) will unveil the Helvar 950 DALI-2 multi-master application controller, Helvar’s flagship product that unlocks vast scalability for projects with four DALI-2 Multi-master networks. The solution also incorporates artificial intelligence-based technology which can self-learn continuously and adapt to the evolving needs of modern buildings. It is also compatible with 3rd party BMS building management systems and can be easily expanded and applied to large and complex projects. Helvar’s projects locate all over the world, like National Gallery UK, Istanbul Airport Turkey, Marina Bay Sands Singapore, Abu Dhabi’s World Trade Centre – Trust Tower, etc.
Another Hong Kong, exhibitor Liricco Technologies Limited (Booth no.: 1A-E08) is known for its partnerships with many notable clients including the Electrical and Mechanical Services Department, Airport Authority Hong Kong. It aims to cater to a wide range of businesses with its Wireless T8 LED tube. This innovative product can save up to 90% of energy and features built-in motion and lux sensors, making it ideal for carparks, staircases, warehouses and factories. It is compatible with Casambi, DALI 2 and Valta operating systems, providing seamless integration for efficient lighting management.
Hangzhou Sky-Lighting Co. Ltd. (Booth no.: 1B-A02) will showcase smart ceiling lights and bulbs equipped with remote control, colour change and timer functions. The remarkable aspect of these products is their universality, as they are compatible with a wide range of popular smart home platforms including Matter, Apple Homekit, Google, Alexa, Tuya, Zigbee and HUE Philips. This versatility allows users to effortlessly integrate the smart lighting solutions into their existing smart home ecosystems.
Yunfan Ruida Technology (Shenzhen) Co. Ltd (Booth no.: 1A-C18) will present its Mmwave radar solution that is applied to smart homes, elderly and nursing homes. Through multi-person trajectory tracking and people counting solution, including trajectory tracking, regional perception and gesture recognition detection, it facilitates the purposes like lighting trajectory interlocking, senseless home interlocking and air gesture switch. It also provides energy management, intelligent lighting and home security via its human presence detecting solution.
Ningbo Xiaojiang IoT Technology Co., Ltd (Booth no.: 1A-C10) is set to exhibit a smart lighting control system and an intelligent lighting solution. The system supports a wide range of IoT modules, including WiFi, BLE, Dual Mode, Matter. With its universal interfaces, it offers seamless switching across multiple platforms, while the intelligent lighting solution caters to diverse scene needs by providing various modes, such as intelligent dimming, gradient light source, reading/writing mode, reading mode, etc.
Running concurrently with the Smart Lighting Expo, the Spring Lighting Fair will continue to serve as a one-stop business platform for diverse lighting products. The Fair welcomes group pavilion from Mainland China’s Xiamen and Jiangsu. The Hall of Aurora will gather renowned brands around the globe to showcase high-quality lighting fixtures, while other product zones will include Commercial Lighting, Decorative Lighting, Residential Lighting, Technical Lighting and Lighting accessories.
Market leaders share insights on lighting trends
In addition to showcasing products, the twin lighting fairs will feature informative forums where industry players will share their insights on the latest trends and developments in the lighting industry. These forums will provide a valuable platform for knowledge exchange and networking among industry professionals.
Asian Lighting Forum, co-organised with Hong Kong Electronics & Technologies Association (HKETA) and Hong Kong Green Building Council (HKGBC), will take place on 6 April. Renowned speakers from The Hong Kong Polytechnic University, Lutron Electronics and LANZ will share their insights on the impact and applications of human-centric lighting while award-winning lighting and green designers from HKGBC, Cundall and Baseline Lighting Design Studio will share remarkable cases across industries to illustrate the market trend of sustainable lighting design.
Artificial intelligence (AI), the Internet of Things (IoT) and Smart Home will be in focus at Smart Lighting Solution Forum, which will be co-organised with Asia-Pacific AI Business Alliance (AIBA) and Shanghai Pudong Intelligent Lighting Association (SILA). To be held on 7 April, experts from Tuya, Amazon and Bluetooth as well as other industry leaders will shed light on the application of these technologies in smart lighting products.
Fair websites
Smart Lighting Expo: smartlightingexpo.hktdc.com
Hong Kong International Lighting Fair (Spring Edition): hklightingfairse.hktdc.com
Hong Kong Trade Development Council
The Hong Kong Trade Development Council (HKTDC) is a statutory body established in 1966 to promote, assist and develop Hong Kong’s trade. With 50 offices globally, including 13 in Mainland China, the HKTDC promotes Hong Kong as a two-way global investment and business hub. The HKTDC organises international exhibitions, conferences and business missions to create business opportunities for companies, particularly small and medium-sized enterprises (SMEs), in the mainland and international markets. The HKTDC also provides up-to-date market insights and product information via research reports and digital news channels. For more information, please visit: www.hktdc.com/aboutus.
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Business
Emirates and the Kenya Tourism Board sign partnership agreement to drive inbound tourism
Published
2 days agoon
September 18, 2026
Reinforcing the airline’s longstanding commitment in market, the partnership agreement supports Kenya’s ambition to be the most visited tourism destination in Africa by promoting the destination in key regions on the airline’s vast global network
The partnership agreement was signed by Adil Al Ghaith, Emirates’ Senior Vice President of Commercial Operations, Centre, and June Chepkemei, Chief Executive Officer of the Kenya Tourism Board, in the presence of Ambassador. (Professor.) Julius K. Bitok, CBS. Principal Secretary, State Department for Tourism, and Adnan Kazim, Deputy President and Chief Commercial Officer, Rashid Alardha, Vice President of Commercial Operations for Sub-Saharan Africa, Emirates and Christophe Leloup, Emirates’ Country Manager in Kenya, along with other senior officials.
Adil Al Ghaith said, “Kenya has been an important market for Emirates for over three decades, and our commitment goes much deeper than operations and connections. We’ve consistently invested in our presence in the market, working closely with travel trade partners and tourism stakeholders to stimulate inbound travel, and contribute positively to the global perception of Kenya. Nairobi remains one of the top 5 busiest gateways for Emirates in Africa, with significant traffic coming from UK and Europe, as well as the US. This partnership solidifies that longstanding commitment, enhancing our collaboration with the Kenya Tourism Board and the full, thriving tourism ecosystem across Nairobi and Kenya.”
We are delighted to partner with Emirates to strengthen Kenya’s global tourism profile and showcase the remarkable experiences our destination offers to travellers around the world
June Chepkemei said, “We are delighted to partner with Emirates to strengthen Kenya’s global tourism profile and showcase the remarkable experiences our destination offers to travellers around the world. Emirates’ extensive international network and strong reach in both established and emerging markets will help us build on the growing demand for Kenya and unlock new opportunities to attract more visitors. This collaboration reflects our shared commitment to promoting Kenya as a leading, diverse and unforgettable destination, while supporting the continued growth of inbound tourism and the many communities that benefit from it.”
Tourism is a key pillar in Kenya’s economy, creating thousands of employment opportunities and serving millions of tourists who visit the country each year. The Kenya Tourism Board has bold plans to establish Kenya as the most visited tourism destination in Africa, with a year-round calendar of diverse, sustainable and authentic experiences that appeal to a swathe of international visitors.
Under the framework of the partnership agreement, Emirates and KTB will explore joint initiatives to promote Kenya in key markets on the airline’s global network, showcasing the breadth of Kenya’s year-round tourism offering, and encourage more travellers to visit. The partners will also closely collaborate to develop programmes for trade partners and tour operators that educate and excite the industry, such as incentives, familiarisation trips and other marketing initiatives.
Last year, Emirates marked 30 years of operations to Nairobi and, during that tenure, has established deep-rooted ties with local communities and the travel trade ecosystem. Earlier this month, the airline’s tour operating arm, Emirates Holidays, signed a Memorandum of Understanding with the Kenya Association of Travel Agents to stimulate outbound travel by equipping over 300 travel agencies with enhanced product and network insight and competitive promotional opportunities.
Distributed by APO Group on behalf of The Emirates Group.
Business
Afreximbank and Development Bank of Southern Africa establish a Joint Project Preparation Facility to advance bankable projects in Southern Africa
Published
2 days agoon
September 18, 2026
Through the JPPF, the institutions will jointly originate, screen and prioritise projects and support the technical, financial and legal work required to address bankability constraints
The agreement is one of the first operational instruments to follow South Africa’s accession to the Afreximbank Establishment Agreement in February 2026. South Africa became Afreximbank’s 54th member state in February 2026, when the Bank also announced a US$ 8 billion Country Programme for the country. The agreement complements the Master Risk Participation Agreement signed by Afreximbank and DBSA in February 2026, extending the partnership upstream into project preparation. It also supports the objectives of South Africa’s National Development Plan 2030, SADC integration and implementation of the African Continental Free Trade Area (AfCFTA).
Mrs Kanayo Awani, Executive Vice President, Intra-African Trade and Export Development, signed on behalf of Afreximbank, while Mr. Greg Fyfe, Chief Investment Officer, DBSA, signed on behalf of his institution.
Through the JPPF, the institutions will jointly originate, screen and prioritise projects and support the technical, financial and legal work required to address bankability constraints. Priority sectors include power and energy, with particular attention to energy transition; transport and logistics; information and communication technology; strategic minerals beneficiation; and other mutually agreed sectors aligned with national, regional and continental development priorities. The framework will focus initially on South Africa and the wider Southern African region, with scope to consider other African jurisdictions of mutual interest.
Through this partnership with Afreximbank, we are leveraging our complementary strengths to improve project preparation
Through the JPPF, Afreximbank and DBSA will collaborate to advance high-impact projects from concept stage to bankability. The focus will be on trade-enabling infrastructure, industrial development, and export-oriented initiatives across South Africa and the Southern African region, with potential extension to other African jurisdictions of mutual strategic interest.
Commenting on the agreement, Mrs. Kanayo Awani, Executive Vice President, Intra-African Trade and Export Development at Afreximbank said:
“Africa’s infrastructure challenge is not only about shortage of capital; it is also about shortage of projects prepared to the standard required by investors and lenders. This JPPF addresses this critical constraint. By combining Afreximbank’s trade and industrialisation mandate with DBSA’s infrastructure-development expertise, we will help move priority projects from concept to investment readiness and mobilise the larger pools of public, private and blended finance required for implementation. For South Africa and the wider Southern Africa region, this is how project preparation becomes a practical instrument for industrialisation, export growth and regional integration under the AfCFTA.”
Gregory Fyfe, Chief Investment Officer at DBSA, said:
“The Joint Project Preparation Facility represents a significant step towards strengthening the pipeline of bankable infrastructure and industrial projects across South Africa and the Southern African region. Through this partnership with Afreximbank, we are leveraging our complementary strengths to improve project preparation. This will unlock investment opportunities and accelerate the delivery of infrastructure that supports economic growth, industrialisation and regional integration. This initiative reflects DBSA’s commitment to infrastructure-led development and to enabling sustainable, long-term impact through well-prepared projects that attract both public and private sector investment.”
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Distributed by APO Group on behalf of Afreximbank.
Events
Advancing the Agentic World, Building a Solid Silicon Foundation
Published
3 days agoon
September 18, 2026
Key takeaways:
- Strategic focus: The rapid approach of an intelligent world is driving up demand for computing power. Huawei is focused on developing AI infrastructure, and is actively driving innovation in systems and architecture centered around SuperPoDs and SuperClusters. These efforts are aimed at building a solid silicon foundation for the intelligent world.
- Technological breakthroughs: Huawei unveiled the Atlas 960E SuperPoD, the first in the industry to use NPO. The company also launched an upgraded TaiShan 950 SuperPoD, as well as the OceanStor M900 (a memory context storage system). Interconnected with UnifiedBus, Huawei’s agentic SuperCluster can scale up to one million NPUs.
- Open ecosystems: Huawei is actively building out open computing ecosystems. To date, the Kunpeng ecosystem has attracted 4.16 million developers from around the world. CANN has moved to sustained, community-driven open-source development. Ascend now spans over 90 leading third-party open-source projects and is officially supported as a PyTorch accelerator backend.
SHANGHAI, CHINA – Media OutReach Newswire – 17 September 2026 – HUAWEI CONNECT 2026 kicked off today in Shanghai. The first keynote of the date was by David Wang, the Deputy Chairman of the Board and Rotating Chairman at Huawei. In his speech (Advancing the Agentic World, Building a Solid Silicon Foundation), Wang highlighted the work the company is doing alongside industry stakeholders to build powerful AI infrastructure, lay a solid computing foundation, and address the challenges and opportunities in the intelligent world to come.
AI is sweeping the world faster than any previous technological revolution. Today, foundation model parameters are rapidly approaching 10 trillion, and are projected to exceed 100 trillion by 2030. AI agents can now work on the same task continuously, for hours on end. By 2030, they will be able to handle tasks that span months.
In China alone, the average number of inference tokens consumed every day has surged to around 500 trillion, and is expected to reach quintillions (1018) by 2030.
On-device AI is also advancing rapidly. On-device models for smartphones have expanded from three billion parameters in 2024 to 30 billion today, and will push toward hundreds of billions in the near future.
These trends will set a much higher bar for the scale, performance, and reliability of underlying technical systems. Only by building powerful AI infrastructure can the industry lay a solid foundation for the future intelligent world.
An intelligent world is approaching – and faster than ever. To lead the charge into this new world, Huawei is laser-focused on building out AI infrastructure – the silicon foundation for the future to come.
In particular, Huawei’s AI strategy is centered on computing power, with a focus on monetizing hardware. The company is also sharpening its competitive edge through systems and architectural innovation. Centering these efforts on SuperPoDs and SuperClusters, the company aims to build a solid computing foundation and offer a new option for the world.
Huawei is a major contributor to open computing ecosystems, and will continue to support native training for mainstream foundation models on its systems, as well as supporting a vast range of models and applications.
For customers, Huawei provides flexible on-premises and cloud compute solutions for its customers to accelerate intelligent transformation across industries.
With diverse forms of compute, including solutions for micro-, low-tier, mid-range, and massive computing power – Huawei is driving the expansion of on-device and in-vehicle AI, making intelligence truly ubiquitous.
Additionally, Huawei is dedicated to building next-generation communications networks to bring readily available compute and intelligence to every person, home, and organization.
SuperPoDs gain broad consensus, with adoption growing in industries, academia, and research institutes
To date, over 1,000 Atlas 900 A3 SuperPoDs have been deployed, and Atlas 950 SuperPoD is seeing large-scale commercial use. While adoption continues to grow, SuperPoDs have gained broad acceptance across industry, academia, and research institutions as a key direction for AI infrastructure. Currently, a SuperPoD is explicitly defined as a computing system in which multiple computing nodes are tightly coupled through high-speed interconnect protocols, featuring unified memory addressing across physical nodes — functioning like a single logical computer.
SuperPoDs are the go-to choice for AI infrastructure buildout. Right now, 100k-NPU computing clusters have become the baseline for training SOTA models. However, traditional server architectures result in intra-cluster communications that account for over 40% of total training time, severely constraining Model FLOPs Utilization (MFU). Simulation results from Huawei’s Markov Lab show that a 100k-NPU cluster built with 4k-NPU SuperPoDs can deliver a 2.75x increase in MFU compared to a 100k-NPU cluster composed of 8-NPU servers.
11-chip UnifiedBus-powered portfolio for SuperPoDs and SuperClusters; the Atlas 960E SuperPoD –the industry’s first to use NPO
The Ascend series of chips is the most critical component in Huawei’s 11-chip UnifiedBus-powered portfolio for SuperPoDs and SuperClusters. Development on Ascend 960 has exceeded the company’s expectations, with performance doubling as planned. Ascend 960DT will be available in Q1 2027, three quarters ahead of the company’s original roadmap. And the Ascend 960PR will be ready in Q3 2027, one quarter ahead of schedule.
“We’re evolving our Ascend chip series on a one-generation-a-year cycle,” said Wang in his keynote. “In 2028 and 2029, we will roll out the Ascend 970 and 980 chips, respectively. Thanks to the Tau (τ) Scaling Law, not only will their compute specifications continue to double, but you can also expect to see huge improvements across the board in terms of memory bandwidth, memory capacity, interconnect bandwidth, and more.”
In addition to Ascend chips, Huawei has also developed a complete portfolio of chips for AI infrastructure, based on UnifiedBus, delivering key capabilities that cover computing, interconnect, storage, and management.
“SuperPoDs are designed to coordinate multiple NPUs through interconnect,” continued Wang. “We have developed a next-generation optical interconnect product based on near-packaged optics (NPO): the High-density Optical-interconnect-Node Engine (Hi-ONE).” Built on Huawei’s proprietary technologies, Hi-ONE has a multi-physics design for balancing optical, mechanical, electrical, electromagnetic, and thermal performance, realizing a transmission capacity of 7.2 Tbit/s per single engine.
“This is the industry’s first NPO product ready for mass production, delivering the largest transmission capacity. It is also the industry’s first NPO product with a built-in light source.”
This product combines high bandwidth and high reliability with low latency and low power consumption. This, coupled with UnifiedBus, will make it far easier to scale up SuperPoD interconnect systems.
Recently, Huawei submitted an implementation agreement (IA) on NPO to the Optical Internetworking Forum (OIF), a standards organization. The response from numerous industry partners has been widely positive. Huawei will continue its efforts to further refine the NPO industry ecosystem.
Using Ascend 960 chips and Hi-ONE, Huawei has developed the industry’s first NPO-based SuperPoDs: the Atlas 960E SuperPoDs. A single Atlas 960E SuperPoD can scale up to 4,096 NPUs, delivering 8 EFLOPS of FP8 compute performance, with up to 1 petabyte of HBM capacity. With 5,500 Hi-ONE units, this SuperPoD doesn’t need the 48,000 800G optical modules that would traditionally be required to connect all the NPUs. This cuts power consumption by over 550 kilowatts, while doubling the system’s fault-free operating time, achieving 99.8% system availability.
Combining the upgraded TaiShan 950 SuperPoD and context memory storage to power an ultrascale cluster with 1 million NPUs
As SOTA models scale to 10 trillion parameters, training and inference can no longer rely on a single AI server or AI SuperPoD – they require a more complex computing system. This system includes AI SuperPoDs, general-purpose SuperPoDs, and an interconnect system that features peer-to-peer interconnect and zero protocol conversion. For inference, including a petabyte-scale KV cache cluster is also a must.
To meet these demands, Huawei has fully upgraded its TaiShan 950 SuperPoD. Powered by UnifiedBus all-optical networking, this new SuperPoD supports up to 4,096 nodes with a unified memory pool of up to 256 TB. This setup significantly improves agent performance. For sandbox-intensive workloads, startup speeds for 100,000 sandboxes are 30 times faster than traditional servers, and sandbox density can be improved by an additional 25%. For vector search across 10 billion x 1,000-dimensional vectors, this SuperPoD delivers twice the search efficiency of traditional servers.
Huawei has also launched OceanStor M900 – a UnifiedBus-powered context memory storage cluster that delivers multi-tier KV caching for agent-heavy and longer-context workloads. Designed for agentic inference, this cluster supports one-hop direct access and provides a petabyte-scale KV cache for the L3.5 layer. OceanStor M900 also uses hybrid media and an optimized retention algorithm, extending SSD read/write lifespan by 16-fold. This ensures a higher KV cache hit rate alongside long-term stability and reliability from the ground up.
Combining its strengths in computing and communications, Huawei has built a brand-new agentic SuperCluster to accelerate training and inference for 10-trillion-parameter models. This SuperCluster uses UnifiedBus to consolidate multiple interconnect protocols into a single unified protocol, significantly reducing protocol conversion overhead. This delivers peer-to-peer interconnect between subsystems like Ascend SuperPoDs, Kunpeng SuperPoDs, and KV cache clusters. The SuperCluster also comes with a multi-tier, high-bandwidth, and large-capacity storage system that enables direct single-hop access for all KV cache tiers.
With a two-tier, four-plane Clos architecture, the SuperCluster can interconnect up to 512,000 NPUs. When combined with a multi-rail topology, this cluster can support up to one million NPUs.
One of Huawei’s core strategies: Going open source and open system to build out computing ecosystems
The Kunpeng ecosystem is driving digital and intelligent innovation across a wide range of industries. To date, the Kunpeng ecosystem has attracted over 4.16 million developers and more than 7,200 ecosystem partners from around the globe. The community currently supports over 560 open-source projects worldwide. openEuler has seen more than 20 million installations, securing the largest share in China’s server OS market.
The Ascend ecosystem has reached a new inflection point. The Compute Architecture for Neural Networks (CANN) is the foundation of the Ascend ecosystem. Today, CANN has moved to sustained, community-driven open-source development, which has brought the platform from usable to user-friendly.
External CANN developers now comprise 61% of all CANN developers, outnumbering internal developers for the first time. With over 5,200 monthly active developers, the CANN community has become the most vibrant open-source community in China. What’s more, over 40 models have been natively pre-trained on Ascend and CANN, making it the only proven domestic stack capable of model pre-training.
Ascend now supports over 90 leading third-party open-source projects, including PyTorch, Triton, vLLM, and veRL. With strong support from the Linux Foundation, Ascend is the first official Chinese compute platform on PyTorch’s website. This gives developers around the world ready access to new innovations in the Ascend ecosystem.
Diverse forms of compute for ubiquitous on-device and in-vehicle AI
AI is expanding faster into all kinds of devices. To deliver an unparalleled AI experience across all scenarios, Huawei will continue to strengthen capabilities in four key areas:
First, Huawei will combine Kirin and Ascend chips to drive self-reliance and autonomy in on-device compute.
Second, Huawei will bring together Pangu models and third-party models to make on-device intelligence better and easier to use.
Third, HarmonyOS, as an Agent OS for ubiquitous intelligence, will be completely redefined from the ground up – spanning system architecture, how it operates, and interaction logic – to enable human-agent collaboration.
Fourth, Huawei will keep cultivating a diverse AI ecosystem, which is the foundation for its system agent Celia to thrive.
Huawei plans to build four on-device computing platforms: for AI phones, AI PCs, vehicles, and homes. Through cross-device and device-cloud compute synergy, Huawei will be able to provide distributed swarm intelligence, delivering integrated and continuous intelligent services across personal mobile, office, vehicle, and home spaces, ultimately bringing intelligence to every person and every space.
Building next-generation communications that prioritize readily available compute, because without networks, all compute is siloed
Next-generation communications networks are crucial for fully unleashing the value of AI compute. We are driving the upgrade to networks that, in addition to connecting people, will prioritize delivering readily available compute. These networks will be underpinned by 5G-A/6G, 10-gigabit optical networks, and multi-tier, low-latency bearer networks, delivering intelligent connectivity across data centers, the edge, and devices.
Concluding his keynote, Wang expressed that AI “may well be the final technological revolution in human history,” noting that its impact is deeper and broader, and coming faster than anyone could have ever imagined. “No single company,” he said, “can build an intelligent world alone.”
He stressed Huawei’s ongoing commitments moving forward:
Huawei will remain committed to building a solid silicon foundation to make computing power readily accessible to all.
The company will continue to open source its software, helping developers unleash their full potential.
It will continue to embrace a wide range of models and applications, unlocking value in every form.
“And we will continue to work together to drive shared success, growing together with our customers and partners around the world,” Wang concluded. “Let’s work together to build a fully connected, intelligent world.”
Themed Advancing the Agentic World, HUAWEI CONNECT 2026 will delve into AI across three dimensions: strategy, technology, and ecosystems. You can expect an in-depth look at our latest strategic initiatives, and we’ll also be unveiling our all-new digital and intelligent infrastructure products, scenario-specific solutions for industries, and development tools. The event will run from September 17 to 19 at the Shanghai World Expo Exhibition & Convention Center and Shanghai Expo Center. For more information, please visit HUAWEI CONNECT 2026 online at www.huawei.com/en/events/huaweiconnect
FAQs:
Q1: What is a SuperPoD, and why is it becoming increasingly important?
A SuperPoD is a computing system in which multiple computing nodes are tightly coupled through high-speed interconnect, enabling them to share unified memory and function like a single computer. As foundation model training and inference continue to scale up, SuperPoDs can reduce communications overhead in large-scale clusters and improve Model FLOPs Utilization (MFU). They have gained broad consensus across industry, academia, and research institutes in AI infrastructure, and are the go-to choice for AI infrastructure buildout.
Q2: What makes the Atlas 960E SuperPoDs special?
The Atlas 960E SuperPoD is the industry’s first NPO-based SuperPoD. A single Atlas 960E SuperPoD can scale up to 4,096 NPUs, delivering 8 EFLOPS of FP8 compute performance, with up to 1 petabyte of HBM capacity. With 5,500 Hi-ONE units, this SuperPoD doesn’t need the 48,000 800G optical modules that would traditionally be required to connect all the NPUs. This cuts power consumption by over 550 kilowatts, while doubling the system’s fault-free operating time, achieving 99.8% system availability. Atlas 960E SuperPoDs can provide efficient and reliable computing power for large-scale AI training and inference.
Q3: What is NPO, and what role does Hi-ONE play in a SuperPoD?
NPO stands for Near-Packaged Optics, an optical interconnect technology designed for high-speed connectivity. Hi-ONE, developed by Huawei, is the industry’s first NPO product ready for mass production. It delivers the largest transmission capacity at 7.2 Tbit/s and is currently the industry’s only NPO product with a built-in light source. Hi-ONE, coupled with UnifiedBus, will make it far easier to scale up SuperPoD interconnect systems.
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